LOCTITE ABLESTIK 5025E
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Thin, uniform bondline control
- Electrically conductive in x,y,z axes
- Excellent electrical and thermal conductivity
Product Description
LOCTITE ABLESTIK 5025E unsupported, epoxy assemly adhesive film is ideal for bonding "hot" devices and printed circuits onto heat sinks in applications where electrical insulation is not required. By leveraging a precise heat and pressure process it achieves a void free connection.
LOCTITE ABLESTIK 5025E passes NASA outgassing standards. It is available in die cut preforms or sheet stock and is only available with 5011 certification.
Cure Schedule
- 30 minutes @ 150°C
- 2 hours @ 125°C
5025E
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK 5025E issue 06-20 (1)
- LOCTITE ABLESTIK 5025E-003 known as Ablefilm 5025E
- LOCTITE ABLESTIK 5025E-003 EN
Technical Specifications
Thermal Properties
General Properties
Electrical Properties
Additional Information
Directions for use
- LOCTITE ABLESTIK 5025E adhesive film is unsupported.
- Handle carefully to avoid any stretching or flexing when frozen.
- It may be helpful during handling to keep at least one sheet of release paper attached.
- Preheat surface to be bonded to approximately 45°C.
- Remove release paper from one side of the adhesive film.
- Apply film to one of the bonding surfaces.
- Remove any trapped air by pressing on the surface
- Allow device to cool to room temperature.
- Remove the release paper from the other side of the adhesive film. Attach the remaining adherent.
- Apply spring loaded clamp or dead weight to provide continuous pressure of at least 2 to 10 psi during cure cycle.
- Place assembly in a preheated oven and cure at the recommended cure schedule.
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