LOCTITE ABLESTIK A329-1
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Class F (155°C)
- Insulating applications
- Resistance to water, freon, solvents etc
Product Description
LOCTITE ABLESTIK A329-1 epoxy encapsulant is designed for insulating applications. It is made thixotropic to prevent sag during heat cure. LOCTITE ABLESTIK A329-1 bonds offer resistance to water, freon, solvents, acids and strong bases.
LOCTITE ABLESTIK A329-1 is a non conductive thixotropic epoxy with oxide filler that is typically used for bonding/insulating metals and for bonding FRP and molded phenolic parts. It is a high temperature performance class F (155°C) sag resistant material with good thermal stability.
Cure Schedule
- 1 minute @180°C
- 3 minutes @160°C
- 20 minutes @120°C
- 90 minutes @100°C
A329-1
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK A329-1 issue 03-17
- MSDS LOCTITE ABLESTIK A329-1 issue 09-20 (EN)
Technical Specifications
Thermal Properties
Electrical Properties
Physical Properties
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