LOCTITE ABLESTIK ABP 8068TH

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK ABP 8068TH

Main features

  • Robust reliability
  • 150 W/mK Thermal Conductivity
  • Low stress

Product Description

LOCTITE ABLESTIK ABP 8068TH is a die attach paste based on silver pressure-less sintering technology for semiconductor packages to meet high thermal/electrical requirements. It has enhanced sintering performance and thermal conductivity, improved resin bleed performance compared with ABP 8068TB.

LOCTITE ABLESTIK ABP 8068TH is formulated with high thermal conductivity to meet thermal dissipation requirements, and its unique sintering system enables excellent workability as well as good stress control to achieve robust reliability performance.

 

Cure Schedule

  • For die size <= 3 x 3 mm
    • 5°C/mins ramp from 25°C to 150°C, hold for 30-60 minutes
    • + 5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
  • For die size > 3 x 3 mm
    • 5°C/mins ramp from 25°C to 150°C, hold for 30-90 minutes
    • + 5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
Product Family

ABP8068TH

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Packaging
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TDS, SDS & Technical Documents
  • TDS LOCTITE ABLESTIK ABP 8068TH issue 10-24
    English (Technical Data Sheet (TDS))
  • CAPLINQ Die Attach Paste Handling Guide
    English (Technical documents)
  • LOCTITE ABLESTIK ABP 8068TH 2.5CC_5CC SY NL-MSDS_UT_NL
    Dutch (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK ABP 8068TH 2.5CC_5CC SY NL-MSDS_UT_EN
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
24 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
8.7 °C
Thermal Conductivity Thermal Conductivity
150 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
0.0000099 Ohms⋅cm
Chemical Properties
Moisture absorption Moisture absorption
0.075 %
Physical Properties
Thixotropic index Thixotropic index
5.3
Viscosity Viscosity
13,500 mPa.s

Additional Information

Recommended cure schedule

  • For the die size <= 3 x 3 mm
    5°C/mins ramp from 25°C to 150°C, hold for 30-60 minutes
    5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven

 

  • For the die size > 3 x 3 mm
    5°C/mins ramp from 25°C to 150°C, hold for 30-90 minutes
    5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven

Thawing

  1. Allow container to reach room temperature before use.
  2. After removing from the freezer, set the syringes to stand vertically while thawing.
  3. Thaw times depend on the syringe size.
  4. Consult handling guide for more information.
  5. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
  6. DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.

Thawing graph for Loctite ABLESTIK ABP8068TH

Direction for use

  1. Thawed material should immediately be placed on dispense equipment for use. 
  2. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
  3. Adhesive must be completely used within the product's recommended work life.
  4. Alternate dispense amounts may be used depending on the application requirements. 
  5. Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern.

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