LOCTITE ABLESTIK ABP 8068TH
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- Robust reliability
- 150 W/mK Thermal Conductivity
- Low stress
Product Description
LOCTITE ABLESTIK ABP 8068TH is a die attach paste based on silver pressure-less sintering technology for semiconductor packages to meet high thermal/electrical requirements. It has enhanced sintering performance and thermal conductivity, improved resin bleed performance compared with ABP 8068TB.
LOCTITE ABLESTIK ABP 8068TH is formulated with high thermal conductivity to meet thermal dissipation requirements, and its unique sintering system enables excellent workability as well as good stress control to achieve robust reliability performance.
Cure Schedule
- For die size <= 3 x 3 mm
- 5°C/mins ramp from 25°C to 150°C, hold for 30-60 minutes
- + 5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
- For die size > 3 x 3 mm
- 5°C/mins ramp from 25°C to 150°C, hold for 30-90 minutes
- + 5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
Packaging
TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK ABP 8068TH issue 10-24
- CAPLINQ Die Attach Paste Handling Guide
- LOCTITE ABLESTIK ABP 8068TH 2.5CC_5CC SY NL-MSDS_UT_NL
- LOCTITE ABLESTIK ABP 8068TH 2.5CC_5CC SY NL-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Recommended cure schedule
- For the die size <= 3 x 3 mm
5°C/mins ramp from 25°C to 150°C, hold for 30-60 minutes
5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
- For the die size > 3 x 3 mm
5°C/mins ramp from 25°C to 150°C, hold for 30-90 minutes
5°C/mins ramp to 200°C, hold for 90-120 minutes, N2 oven
Thawing
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to stand vertically while thawing.
- Thaw times depend on the syringe size.
- Consult handling guide for more information.
- DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.

Direction for use
- Thawed material should immediately be placed on dispense equipment for use.
- If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
- Adhesive must be completely used within the product's recommended work life.
- Alternate dispense amounts may be used depending on the application requirements.
- Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern.
Recently viewed products

A6225| Anti bleed Additive
- Universal additive
- Reduces bleed out on metal surfaces
- Non halogenated

LOCTITE STYCAST OB4000
- LED Encapsulation
- Moisture resistant
- Excellent thermal shock properties

Hysol GR300S | Black Epoxy Mold Compound
- Low CTE (15 ppm/°C)
- Low stress
- High productivity

Hysol MG40FS | Black Epoxy Mold Compound
- Designed for PDIP packages
- Excellent HTRB performance
- Ideal for high voltage discrete semiconductors

Hysol GR2821 | Black Epoxy Mold Compound
- Completely Superseded by GR2820
- Ultra-low stress epoxy mold compound
- Thin Wall Crack Resistance

LOCTITE SI 5088
- Straw colored liquid
- UV Cure
- Alkoxy Silicone

LINQCELL GDP340 | 340um Non woven Carbon Paper
- 0.34mm - 340um - 13.4mil
- Non woven
- Highly flexible - Roll form
ODF-10 | Diffusion Agent for LEDs
- Diffusion agent
- Low effect on brightness
- Soft and consistent luminosity

PTM 7900 | Phase Change Pad
- 0.045 Thermal Impedance
- 8.0 Thermal Conductivity
- Pad form