EC Nanoscale Epoxy control
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- Eliminating Die Attach Epoxy bleed
- Epoxy control in Semiconductor packaging
- Excellent chemical bonding to many surfaces
Product Description
Aculon EC nanoscale thickness (4nm) repellency product is a surface treatment that uses it’s hydrophobicity and oleophobicity characteristics to create epoxy repellent surfaces to control the location of epoxy used in semiconductor packaging. Applications include eliminating die attach epoxy bleed, reduce underfill epoxy keep-out areas around flipchip die, and eliminating EMC mold flash contamination. Added features include: wirebondable when used on a metal wirebond pad, repels: water, oil, flux, solder paste, and many solvents. In general use, it is designed to bond to most metals and certain polymers and resists chemical and mechanical degradation
AculonEC
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Epoxy control EC TDS
- Epoxy control EC SDS
