EMC-G836 | Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- For QFN & QFP packages
- Meets JEDEC MSL 3 reliability requirements
- High spiral flow
Product Description
LINQSOL EMC-G836 is a halogen-free epoxy molding compound engineered for the precise encapsulation of a wide range of semiconductor packages, including Quad Flat No-Leads (QFN), Quad Flat Packages (QFP), and other thin, high-density packages like BGA TF cards (microSD). Its design focuses on delivering both superior performance and exceptional reliability.
Product Key Features
- Wide gel time (36s) — offers a broader processing window, ideal for QFN and QFP molding applications.
- High spiral flow (149cm) — meets demanding flowability requirements for intricate package designs.
- Low water absorption
- RoHS and REACH compliant
Applications
- Encapsulation of quad flat no-leads (QFN) & quad flat packages (QFP)
- Encapsulation of thin, high-density packages, including BGA TF cards (microSD)
EMC-G836
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-G836
Technical Specifications
General Properties
Physical Properties
Thermal Properties
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