LOCTITE ECCOBOND EO7021
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Fast cure
- Glob top
- Die attach & Encapsulant
Product Description
LOCTITE® ECCOBOND EO7021 one component encapsulant is designed for use in smart card chip module applications. It cures fast at moderate temperatures and is also suitable for die attach automated reel to reel processing. It's a good and very reasonably priced die attach/encapsulation combination similar to EO7029.
LOCTITE® ECCOBOND EO7021 has great compatibility with the newly formulated LOCTITE ABLESTIK ABP 2035SCR which and has been improved to be compatible with UV-curable smart card encapsulants.
EO7021
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND EO7021
- MSDS 456899 en_GB
- LOCTITE EO7021
Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Physical Properties
Additional Information
Recommended Cure for Reel-to-Reel Processing
- Substrate and Chip Module Preheat, ºC 100
- Precure 3 minutes @ 140°C
- Postcure (after reel is completely full) 16 hours @ 100°C
Alternate Cure for Reel-to-Reel Processing
- Precure 1 hour @ 100°C
- Postcure 6 hours @ 120°C
This applies only to coating chip module with 10 to 100 mg of LOCTITE EO7021.
Recommended Cure for Non-Conductive Die Attach Application
- 1 hour @ 120°C or
- 5 minutes @ 150°C
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