LOCTITE ECCOBOND FP4502
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- One component
- Low CTE
- No-clean flux compatible
Product Description
LOCTITE® ECCOBOND FP4502 is a high purity, liquid epoxy designed as an underfill for flip chip devices. It is a single component epoxy with low CTE that has an improved toughness and forms a rigid, low stress seal.
LOCTITE® ECCOBOND FP4502 is used to dissipate stress on solder joints, extends thermal cycling performance, is compatible with no clean flux and has improved crack and fracture resistance.
Cure Schedule
- 30 minutes @ 165°C
- 2 minutes, hours @ 150°C
FP4502
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 125 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4502 US SDS
- ECCOBOND FP4502-EN
- LOCTITE ECCOBOND FP4502 known as Hysol FP4502 10CC
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Recently viewed products
LOCTITE FP4804 | Epoxy Underfill
- Good flowability
- Low CTE/modulus (reduced stress)
- No resin bleed out on glass
Hysol GR2220 | Black Epoxy Mold Compound
- Designed for MnO-based tantalum capacitors
- Lower cost of ownership
- High productivity, easily moldable
A6280 | Anti bleed Additive
- Use in Non-metal-filled systems
- Excellent bleed control on Gold surfaces
- Non halogenated
LINQBOND LB-FL501 | Fill encapsulant
- Fill
- Low CTE a1: 23 ppm/°C
- Easily flow, low viscosity
Hysol GR2812 | Gold Epoxy Mold Compound
- Replaces GR2811
- Thin wall crack resistance
- MSL3 260°C capability
LOCTITE GC 18
- SAC 305 - No refrigeration
- Low voiding
- Stencil Printable
Hysol GR350HT | Black Epoxy Mold Compound
- High Thermal Conductivity GR30
- Designed for TO92 and TO220 packages
- Excellent reliability under high temperature and bias
