Hysol GR700 C4C | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High reliability
- High power applications
- Good electrical performance
Product Description
Hysol GR700 C4C is a halogen free, black, silica filled (89% filler weight) semiconductor grade epoxy molding compound with a 75um filler cut size. This low stress, high adhesion compound has very good electrical performance and is currently under development, striving to provide high reliability for high power applications. This is a product that has achieved MSL 1 and its comparative tracking index (CTI) is 575V.
Hysol GR700 C4C is a green epoxy molding compound with excellent electrical performance, designed for high power devices applications with low moisture absorption requirements. Typical use can be found in SOP, DPAK, QFP, QFN semiconductor packages. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.
GR700-C4C
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TDS, SDS & Technical Documents
- LDS_ GR700 C4C (1)
- GR510 GR700 GR710 GR920 Product Introduction
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Physical Properties
Thermal Properties
Curing Conditions
Additional Information
GR700 Series for High-reliability Small Outline Packages
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