Hysol GR825-73B | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- MSL 1 260°C
- Designed for SOIC, SOP, SSOP & QSOP
- Ideal for NiPdAu (PPF) & Ag-spot leadframes
Product Description
Hysol GR825-73B is approaching EOL and may be discontinued by 2023. The recommended alternative for SOIC packages is Hysol GR710F
Hysol GR825-73B is a black, semiconductor grade epoxy molding compound that was designed for SOIC packages. It was first qualified as MSL1 260°C on a 14 pin SOIC package with a die size of 1.4x 0.9mm (58 x 36 mils) using a Nickel Palladium Gold (NiPdAu) leadframe, also referred to as a preplated leadframe (PPF). It has since been used in mass production on this semiconductor package. Except for SOIC, it can also be used on, SOP, SSOP & QSOP packages.
Hysol GR825-73B is an environmentally friendly "green" molding compound which contains no bromine, antimony or phosphorus flame retardant and has been used in mass scale production since 2007. GR825-73B epoxy mold compound meets UL 94 V-0 Flammability at 3mm (1/8") thickness.
GR825-73B
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hysol GR825 73B
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Electrical Properties
Curing Conditions
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