HGP14

Main features

0.10 Thermal Impedance
14 Thermal Conductivity
Low oil bleeding & Low volatile

Product Description

Honeywell HGP14 is a high-performance thermal interface material designed for efficient heat transfer in demanding electronic applications. It offers a thermal conductivity of 14.0 W/m·K, making it well-suited for systems requiring high thermal dissipation across varying bond line thicknesses.
The material is soft and conformable, allowing it to fill gaps between components and heat sinks without introducing significant mechanical stress. This makes it suitable for use with fragile components or assemblies where minimizing stress during installation is critical.

HGP14 also maintains material integrity over time, with low volatility and minimal oil bleed, reducing the risk of contamination or pump-out under thermal cycling. Its stability makes it a strong choice for applications sensitive to oil migration or where long-term performance is required.
Honeywell HGP14 is well-suited for high-power electronics, automotive systems, and telecommunications equipment, where superior heat dissipation and long-term stability are essential.

Packaging

Please select Package Type before adding your product to your cart.

Technical Specifications

General Properties

Color

Gray

Film Thickness

0.5 - 2 mm

Specific Gravity

3.3

Thermal Properties

Thermal Conductivity

14.0 W/m.K

Thermal Impedance

0.1 °C·cm²/W

UL 94 Rating

V-0

Electrical Properties

Volume Resistivity

10000000000000 Ohms⋅cm

Additional Information

Applications That Benefit Most from High Thermal Conductive HGP14

Case 1: Improving Thermal Efficiency in High-Density 5G RF Amplifiers

5G telecom base stations rely on high-power RF power amplifier (PA) modules that generate significant heat densities. As module power output increases, maintaining thermal stability and preventing derating becomes a major design challenge which may results to thermal throttling.

Technical Issues:

Hotspots of +18°C above average due to poor conformability
Module derating occurred during extended high power operation
Long-term reliability concerns (voiding, pump-out, bleed contamination)

Case 2: Enhancing Thermal Management in High-Power Industrial LED Lighting

High-power industrial LED fixtures such as those used in factories, warehouses, tunnels, and outdoor infrastructure operate continuously and generate significant heat at the LED junction. Excess heat leads to lumen depreciation, color shift, and premature failure, making efficient thermal management essential for maintaining long service life and consistent light output.

Technical Issues:

LED junction temperatures exceeding design limits, causing early lumen drop-off
Hotspot formation due to uneven metal-core PCB (MCPCB) surface contact
Thermal grease dry-out over time leading to increased thermal resistance
Long-term reliability concerns during 24/7 operation in hot or enclosed environments

Case 3: Improving Thermal Control in AI Servers and GPU Accelerator Modules

Modern AI training and inference servers use multi-die GPU accelerators that generate extreme heat fluxes, especially during sustained workloads. Maintaining low thermal resistance across complex module topographies is essential to prevent performance throttling and maintain system uptime in data centers.

Technical Issues:

High heat flux (exceeding 300 W/cm²) from stacked GPU dies
Gap variation due to tolerances in heat spreaders and interposers
Performance throttling during extended ML training workloads
Long-term aging concerns with traditional pads at elevated temperatures

Case 4: Thermal Stabilization in Automotive ADAS Control Units

Advanced Driver Assistance Systems (ADAS) rely on high-power processors, radar modules, and sensor fusion units that operate continuously under harsh automotive temperature cycles. These compact modules generate high heat loads that must be controlled to prevent thermal throttling and loss of processing performance.

Technical Issues:

Peak temperatures approaching thermal throttling threshold during continuous lane-assist operation
Uneven PCB-to-housing gaps due to vibration and mechanical tolerances
Traditional gap fillers showing micro-voiding after extended thermal cycling
Risk of reduced processing speed and degraded ADAS reliability

How HGP14 Helps in These Cases

Solstice HGP14 provides a consistent thermal advantage across all the applications mentioned. Its high thermal conductivity of 14 W/m·K allows heat to move quickly away from critical components, helping to lower junction temperatures and prevent performance loss under heavy load. Overall, HGP14 supports reliable heat transfer, improves operational stability, and helps extend the lifetime of electronics that operate under high thermal stress.

About Krayden

About Krayden

About Krayden

HGP14 | High Thermal Conductivity Gap Pad

Main features

Product Description

Technical Specifications

Additional Information

Recently viewed products

Leading Brands Trust in Our Products and Services