LINQBOND LB-DM801 | Dam encapsulant
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Dam Encapsulant
- Low CTE
- High thixotropic index
Product Description
LINQBOND LB-DM801 is a high-performance, one-component epoxy adhesive specifically designed to work in conjunction with LB-FL501 as a dam material for semiconductor packaging. Together, these products provide a comprehensive solution for encapsulating and protecting electronic components.
With its low thermal expansion coefficient (CTE1: 20 ppm/°C, CTE2: 60 ppm/°C), LB-DM801 effectively prevents fill materials from spreading, ensuring precise control of encapsulant placement. Its thixotropic nature (TI: 3.1) and viscosity of 41800 cps at 25°C provide excellent sag resistance and dimensional stability, even on vertical surfaces.
Cure Schedule
- 40 minutes @ 150°C
- 20 minutes @ 160°C
LB-DM801
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQBOND LB-DM801
Technical Specifications
Thermal Properties
Physical Properties
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