OPTOLINQ LE-8011HT | Two part epoxy resin
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features
- Excellent thermal stability
- Excellent UV stability
- High light transmittance
Product Description
OPTOLINQ LE-8011HT is an epoxy resin specifically designed for infrared device packaging applications. This resin exhibits superior thermal stability and excellent UV stability, ensuring that devices can withstand high temperatures and ultraviolet light exposure without degradation.
Upon curing, OPTOLINQ LE-8011HT forms robust cross-linked networks, providing strong adhesion and maintaining airtight seals. These properties make LE-8011HT an ideal high-performance and High Transmittance solution for IR device packaging. LE-8011HT delivers comparable optical functionality as Loctite Stycast OS4000 with AC 7115 dye.
Key Features
- Designed for Optoelectronic Device Packaging: effectively seals and protects optoelectronic components.
- Superior Thermal Stability: LE-8011U can withstand high temperatures without degrading.
- Excellent UV Stability: Resistant to damage and degradation from exposure to ultraviolet light.
- High Optical Clarity: Delivers exceptional light transmission, critical for optoelectronic device functionality.
- Strong Adhesion: Provides excellent bonding strength to diverse substrates, enhancing package reliability.
- Enhanced Air Tightness: Offers effective barrier properties, minimizing gas permeation and protecting sensitive components.
Available versions
Packaging
TDS, SDS & Technical Documents
- TDS_OPTOLINQ LE-8011HT
- SDS_OPTOLINQ LE-8011HT Part A
- SDS_OPTOLINQ LE-8011HT Part B
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
To meet higher application requirements, liquid encapsulation is expected to have (1) excellent thermal stability; (2) low transmittance decay. Our resin technology could help meet these challenges. With the resin improved in LE-8011HT, the pot life increased (~7 hours), and viscosity decreased (~400-800 cP). LE-8011HT is a Visible light-blocking encapsulation based on the optically clear version LE-8011U product platform, both products remain with superior anti-blue decay and thermal aging stability. Worth to be mentioned, the properties of both products remains within the same range, apart from their appearance in color and optical performance.




Processing Instructions
- Mix components A and B in a 100:95 weight ratio and stir uniformly. Ensure that the mixture is uniform and free from streaks or unevenness.
- Defoam the mixture under vacuum conditions for 5 minutes.
- Recommended curing condition: First cure at 130 °C for 1 hour, then post cure at 150 °C for 4 hours.
Curing conditions should be determined according to the specific needs of the package being encapsulated, the conditions mentioned are for reference only.
Storage and Handling
The uncured resin can be cleaned with acetone or a suitable cleaning agent. Water cannot be used as cleaning agent.
Store in a cold, dry, and clean environment between 10–30 °C with relative humidity below 70%. Keep away from exposure to direct sunlight. It is strictly forbidden to store in outdoor environments. At proper storage conditions, unopened Part A and Part B have a shelf life of 12 months.
Recently viewed products

PEAM-645 High Tg Polyester Acrylate/Methacrylate
- High Tg
- Low CTE
- High adhesion to various substrates

Hysol GR900C Q1L4E | Black Epoxy Mold Compound
- Low filler cut size
- MSL1 260°C Capable EMC
- Compatible with Copper Wire

Hysol MG36F-25A | Black Epoxy Mold Compound
- Low cost epoxy molding compound
- Good reliability
- For discrete and low count PDIP

LINQSOL EMC-G833 | Black Epoxy Mold Compound
- Green epoxy molding compound
- Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
- Excellent reliability performance

LINQSOL EMC-7535MF | Black Epoxy Mold Compound
- Green molding compound
- Designed for high-power TO packages
- High Tg, low water absorption, low modulus, and excellent thermal stability