PM-SI611 | Silicone Potting material
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

Main features
- High temperature resistance
- High flowability
- Void free casting
Product Description
LINQBOND PM-SI611 is a two-part, grey RTV silicone potting material designed for various applications like electrical potting, PCB encapsulation, LED drivers, cable joining, and surge protection. It offers excellent high-temperature performance and easy reworkability, making it durable and adaptable.
LINQBOND PM-SI611 low viscosity ensures smooth flow, deep penetration, and void-free encapsulation of intricate components. The formula reduces porosity, resulting in strong, reliable castings. Additionally, PM-SI611 has built-in fire-retardant properties, adding safety to critical applications.
Applications:
- Electrical Potting
- PCB Encapsulation
- LED Driver Potting
- Cable Joining
- Surge Protection Device
Product Features & Benefits:
Unmatched High-Temperature Performance & Re-workability: LINQBOND PM-SI611 stands out by offering a rare combination of high-temperature resistance, ensuring reliability in extreme conditions, coupled with excellent re-workability, allowing for easy component repair or replacement, saving time and resources.
Superior Safety & Compliance (UL94 V-0): With its UL94 V-0 flammability rating, this potting material provides an exceptional level of fire safety, exceeding industry standards and ensuring protection for critical applications and peace of mind for users.
Streamlined Processing for High-Volume Manufacturing: The low viscosity and machine pourability of LINQBOND PM-SI611 make it ideal for automated dispensing, facilitating efficient and cost-effective high-volume production while maintaining consistent quality and performance.
Packaging
TDS, SDS & Technical Documents
- TDS _LINQBOND PM-SI611
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Processing Instructions
-
Before mixing, stir both Part A and Part B to homogenize.
-
Mix components A and B according to the specified weight ratio. Stir thoroughly to ensure uniformity while preventing air from introduced into the mixture. Ensure contamination is avoided.
-
To ensure complete mixing of both parts, machine mixing and dispensing are recommended. Static and dynamic mixer can also be used for mixing.
-
Degas the mixture to remove the bubbles for about 10 minutes. Do not fill the container more than half full to prevent overflowing during degassing.
-
Gradually pour the mixed compound into the device being potted.
-
Allow the potted workpiece to cure. The curing process is influenced by temperature variations; generally, higher temperatures result in faster curing, while lower temperatures lead to slower curing.
Packaging
LINQBONDTM PM-SI611 Part A and Part B is available in 30 kg open top plastic buckets.
Storage and Handling
Store in a ventilated, dry, and clean environment at 30±5 °C. Keep away from fire and heat sources. It is strictly forbidden to store in outdoor environments. At proper storage conditions, both Part A and Part B have a shelf life of 6 months.
Recently viewed products

MCL-T20 | Melamine Transfer Cleaning Pellets
- Excellent Cleaning Efficiency
- Ideal for High-Precision Industries (Electronics and Automotive)
- Enhanced Mold Lifespan and Minimized Downtime

LOCTITE 3508NH
- Reworkable
- Reflow curable
- Improves mechanical reliability

LINQSOL EMC-G374
- Ultra-high glass transition temperature (272 °C)
- Designed for high-power SiC and GaN devices
- High degradation temperature, and excellent thermal stability

PEAM-645 High Tg Polyester Acrylate/Methacrylate
- High Tg
- Low CTE
- High adhesion to various substrates

Hysol GR900C Q1L4E | Black Epoxy Mold Compound
- Low filler cut size
- MSL1 260°C Capable EMC
- Compatible with Copper Wire

Hysol MG36F-25A | Black Epoxy Mold Compound
- Low cost epoxy molding compound
- Good reliability
- For discrete and low count PDIP

LINQSOL EMC-G833 | Black Epoxy Mold Compound
- Green epoxy molding compound
- Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
- Excellent reliability performance

LINQSOL EMC-7535MF | Black Epoxy Mold Compound
- Green molding compound
- Designed for high-power TO packages
- High Tg, low water absorption, low modulus, and excellent thermal stability