LOCTITE SI 5404
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrical isolation
- Thermally conductive
- Bond metallic heat sinks
Product Description
LOCTITE SI 5404 is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. LOCTITE SI 5404 applications include the bonding of various heat generating devices (power devices) to their respective heat sinks.
LOCTITE SI 5404 is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. A typical application would be the bonding of any power semiconductor, module, graphics processor or other heat generating device to a heat sink or metal enclosure in an electronics circuit.
LOCTITE SI 5404 is a "heavy paste" type of substance and that’s why extrusion rate is mentioned on TDS, instead of viscosity. This is a measurement of a certain amount per minute which will be squeezed out of the cartridge after applying pressure. If you need TC higher than 1 W/mK you might be interested in SI5406M RTV silicone with 1.5 W/mK.
Cure Schedule
- 10 minutes for 150°C
- 15 minutes for 130°C
IR or Convection oven
SI5404
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS LOCTITE SI 5404 issue 05-14
- 354964_MSDS_UT_US_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Additional Information
We are dealing with multiple materials in our lab. How should we approach Silicones? Any standards or methods?
We are not aware of any standards that deal with the compatibility of silicones and other adhesives. It is clear that silicones are bad for adhesion for non-silicone materials so you should try to avoid cross-contamination. We would keep these separate or apply silicone as the last step, if possible.
Regarding Pot life, this heat-curing silicone material is stable for days at temperatures below 30°C. We do not have specific test data on this.
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