LOCTITE ECCOBOND UF 8807
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Cyanate Ester
- Fast cure - Low temp
- Superior adhesion after moisture testing
Product Description
LOCTITE ECCOBOND UF 8807 is formulated using a novel moisture Resistant Cyanate Ester (MRCE) chemistry. This material's characteristics help to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications on organic substrates. It is silica filled with 63.5% solids content.
LOCTITE ECCOBOND UF 8807 is an electrically insulating, semiconductor level capillary underfill that offers excellent flow characteristics for high density arrays. An optimized particle size distribution allows LOCTITE ECCOBOND UF 8807 adhesive to flow rapidly into gaps of 10 mil and greater to form a protective polymer when cured.
Cure Schedule
- 15 minute ramp to 165°C + 30 minutes @ 165°C
- 3 hours @ 125°C
UF8807
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TDS, SDS & Technical Documents
- ECCOBOND UF 8807-EN
- 1454433_MSDS_UT_GB_EN
- CAPLINQ Underfill Material Handling Guide
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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