LOCTITE ABLESTIK 570K

Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other

LOCTITE ABLESTIK 570K

Main features

  • Low outgassing
  • High purity
  • Hybrid substrate attach

Product Description

LOCTITE ABLESTIK 570K adhesive film is a high purity epoxy designed for hybrid substrate attach. This adhesive exhibits significantly better adhesion to gold surfaces, resulting in improved performance during constant acceleration testing compared with similar high purity materials.

LOCTITE ABLESTIK 570K is a low outgassing, brown epoxy assembly film that meets the requirements of MIL-STD-883C, Method 5011.

Cure Schedule

  • 3 hours @ 150°C
  • 1.5 hours @ 170°C
Product Family

570K

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Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Product availability
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CA Shipping in 12 weeks
EU Shipping in 12 weeks
Packaging
Please select Package Type and Thickness before adding your product to your cart.
TDS, SDS & Technical Documents
  • ABLESTIK 570K-EN
    English (Technical Data Sheet (TDS))
  • LOCTITE ABLESTIK 570K-1-006 known as Ablefilm 570K-1-006(5011),6x6 NL-MSDS_UT_NL
    Dutch (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK 570K-1-006 known as Ablefilm 570K-1-006(5011),6x6 NL-MSDS_UT_EN
    English (Safety Data Sheet (SDS))
  • TDS LOCTITE ABLESTIK 570K issue 04-14
    English (Technical Data Sheet (TDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
336 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
135 °C
Thermal Conductivity Thermal Conductivity
0.7 W/m.K
Weight Loss @ 300°C Weight Loss @ 300°C
0.3 %
Electrical Properties
Volume Resistivity Volume Resistivity
600000000000000 Ohms⋅cm

Additional Information

LOCTITE ABLESTIK 570 will be discontinued in 2025.,  570K is an improved version (higher thermal conductivity and lower CTE) and is the best alternative.

 

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