DOWSIL™ TC-4060 Thermal Gel

Main features

6 W/m·K
Room-temperature cure
100% silicone (PDMS) formulation

Product Description

DOWSIL™ TC-4060 Thermally Conductive Gel is a two-part, room-temperature-curing silicone gel engineered to provide efficient heat transfer from PCB-mounted components to heat sinks while maintaining a soft, compressible interface that helps protect sensitive electronics from mechanical stress. Delivering 6 W/m·K thermal conductivity, TC-4060 combines high thermal performance with excellent dielectric insulation, long-term reliability during temperature cycling up to 150°C, and resistance to environmental contaminants. Its 1:1 mix ratio, 80-minute pot life, and compatibility with automated meter-mix dispensing systems support seamless integration into high-volume manufacturing processes. Once cured, the 100% silicone (PDMS) gel acts as a durable thermal interface that absorbs shock, vibration, and thermal expansion mismatch while maintaining consistent thermal contact over time.

Product Key Features

6 W/m·K thermal conductivity for efficient heat dissipation.
Soft, compressible silicone gel for stress relief and vibration damping.
Room-temperature cure in 24 hours at 22°C.
Optional heat-accelerated cure in 30 minutes at 80°C.
100% silicone (PDMS) formulation for long-term durability and stability.
Designed for automated meter-mix dispensing and high-volume manufacturing.
Excellent dielectric properties with 9 kV/mm dielectric strength.
High electrical insulation with volume resistivity of 4 × 10¹² Ω·cm.
Long-term thermal cycling stability up to 150°C.
Optional 250 µm glass beads available for bondline thickness control.
Shock and vibration absorption for improved reliability of sensitive electronics.
Suitable for PCB-to-heat-sink cooling, power electronics, industrial controls, telecom systems, and electronic modules.

Packaging

Please select Package Type and Color before adding your product to your cart.

TDS, SDS & Technical Documents

11-4241-01-dowsil-tc-4060-thermally-conductive-gel
English (Technical Data Sheet (TDS))
DOWSIL™ TC-4060 Thermal Gel-Safety Data Sheet-EN
English (Safety Data Sheet (SDS))

Technical Specifications

General Properties

Color

Part A: White | Part B: Blue

Component System

Two Part

Mix Ratio

1:1

Pot Life

@22°C 80 minutes

Specific Gravity

Part A/B: 3.5

Physical Properties

Viscosity (Part A)

@1/s 450000 mPa.s

Viscosity (Part B)

@1/s 540000 mPa.s

Thermal Properties

Thermal Conductivity

5.6 W/m.K

Electrical Properties

Dielectric Strength

9 kV/mm

Volume Resistivity

4E+12 Ohms⋅cm

Additional Information

DOWSIL™ TC-4060: 6 W/m·K Thermally Conductive Silicone Gel

DOWSIL™ TC-4060 Thermally Conductive Gel is a two-part, room-temperature-curing silicone gel designed to dissipate heat from PCB-mounted components to heat sinks while providing a soft, compressible thermal interface. With 6 W/m·K thermal conductivity, long-term stability during temperature cycling up to 150 °C, and optional 250 µm glass beads for bondline control, TC-4060 supports reliable thermal management in compact electronic assemblies.

High thermal conductivity with soft gel compliance — TC-4060 delivers 6 W/m·K thermal conductivity while curing into a soft elastomer that helps absorb stress, vibration, and thermal expansion mismatch.

Designed for automated meter-mix dispensing, TC-4060 supports smooth production line integration for electronics requiring reliable heat transfer from components to heat sinks, housings, or cold plates.

Soft, compressible thermal gel for reliable cooling — suitable for PCB-mounted components, heat sink interfaces, power electronics, control modules, and compact electronics where high thermal conductivity and stress relief are required.

The 100% silicone PDMS chemistry helps provide durable dielectric insulation, environmental protection, and resistance to ozone, UV degradation, and broad temperature and humidity conditions.

DOWSIL TC-4060 thermally conductive gel for PCB to heat sink cooling

6 W/m·K Thermal Conductivity • Room-Temperature Cure • Soft Gel Compliance • Stable up to 150 °C

Features & Benefits

High thermal conductivity — 6 W/m·K for efficient heat transfer.
Soft and compressible cured gel — helps reduce stress on sensitive components.
Room-temperature cure — cures in 24 hours at 22 °C.
Optional heat acceleration — cures in 30 minutes at 80 °C.
100% silicone PDMS — durable silicone chemistry for electronics reliability.
Optional 250 µm glass beads — supports controlled bondline design.
Excellent dielectric performance — 9 kV/mm dielectric strength and high volume resistivity.
Automated dispensing compatible — designed for meter-mix equipment.

Typical Applications

PCB-mounted component cooling.
Component-to-heat-sink thermal interfaces.
Power electronics thermal management.
Electronic control modules.
Telecom and industrial electronics.
Automated meter-mix dispense applications.
Soft gap-filling thermal interfaces requiring stress relief.

Electronics Thermal Management Perspective

Thermal Challenges in PCB and Module Cooling

As electronic assemblies become more compact and power-dense, designers need thermal interface materials that can efficiently transfer heat while protecting sensitive components from mechanical stress. DOWSIL™ TC-4060 addresses these needs with a high-conductivity silicone gel that cures into a soft, compressible elastomer, helping move heat from PCB-mounted components to heat sinks while absorbing shock, vibration, and thermal cycling stress.

High Heat Transfer

6 W/m·K thermal conductivity helps create an efficient path from hot components to heat sinks or thermal hardware.

Stress Relief

The soft gel structure helps reduce mechanical stress from thermal expansion mismatch, shock, and vibration.

Production Integration

The two-part 1:1 system is designed for automated meter-mix dispensing and smooth assembly line integration.

Typical Properties

Engineering Data for DOWSIL™ TC-4060

Property	DOWSIL™ TC-4060	Condition / Note
Chemistry / Type	Two-part silicone gel	100% silicone PDMS
Mix Ratio	1:1	By weight or volume
Appearance	Part A: White Part B: Blue	Typical appearance
Thermal Conductivity	6 W/m·K	CTM 1163 A
Thermal Conductivity	5.6 W/m·K	ASTM D5470
Cure Time at 22 °C	24 hours	Room-temperature cure
Cure Time at 80 °C	30 minutes	Heat-accelerated cure
Pot Life at 22 °C	80 minutes	ASTM D1824
Durometer	Shore 00 55	After 24 h at 25 °C
Durometer	Shore 00 58	After 1 h at 110 °C
CTE	230 ppm/°C	Typical value
Dielectric Strength	9 kV/mm	Electrical insulation
Volume Resistivity	4E+12 Ohm·cm	Typical value
Useful Temperature Range	-40 to 150 °C	Long-term operation

*Typical properties are not intended for specification writing. Verify performance under actual application, substrate, assembly, and reliability conditions.

Applications

Where DOWSIL™ TC-4060 Fits

PCB Component Cooling

TC-4060 is designed to dissipate heat from components mounted on printed circuit boards to heat sinks or cooling structures.

Processors and ICs
Power components
High-density PCB modules

Power Electronics

The soft silicone gel helps create a thermally conductive path while reducing mechanical stress in power-dense electronic modules.

Converters
Inverters
Control electronics

Automated Dispensing

Designed for smooth assembly line integration using automated metered mixing and dispensing equipment.

Meter-mix dispense
High-volume electronics assembly
Controlled thermal interface placement

Processing

Mixing, Dispensing & Cure

Mixing

Mix Part A and Part B at a 1:1 ratio by weight or volume. A static mixer is recommended for manual and automated mixing.

Dispensing

Use automated metered mixing and dispensing equipment for smooth line integration. Automated airless dispensing can help reduce or avoid de-airing.

Curing

Cures at 22 °C in 24 hours, with optional heat acceleration to 30 minutes at 80 °C. Cure progresses evenly without by-products.

Technology Advantage

How TC-4060 Supports Reliable Thermal Design

Design Challenge	DOWSIL™ TC-4060 Benefit
High-power components generate localized heat on PCB assemblies.	6 W/m·K thermal conductivity supports efficient heat transfer to heat sinks.
Rigid materials can transfer stress to sensitive solder joints and components.	Soft, compressible gel helps absorb mechanical stress, shock, and vibration.
Production lines require consistent dispensing and assembly integration.	Two-part 1:1 formulation supports automated meter-mix dispensing.
Electronics require insulation and environmental protection.	Silicone gel provides dielectric insulation, moisture barrier support, and chemical stability.

Technical Guidance

Tips & Troubleshooting

Issue	Recommended Action
Inadequate Mixing	Confirm 1:1 mix ratio by weight or volume. Use a static mixer for manual or automated mixing. Check for streaks or marbling, which may indicate incomplete mixing.
Voids in Cured Gel	Use automated airless dispensing where possible. If de-airing is required, apply vacuum until bubbling subsides. Minimize trapped air during dispensing and component placement.
Filler Settlement Concern	Thoroughly mix each container before use if stored for several weeks. Inspect material uniformity before production dispensing. Keep containers tightly closed and follow label storage instructions.
Thermal Performance Below Target	Ensure complete surface wet-out between component and heat sink. Review bondline thickness and compression during assembly. Reduce voids and gaps in the thermal path.

Package & Support

Technical Help for Thermal Gel Applications

Processing Support

Review meter-mix dispensing strategy.
Assess cure profile and production flow requirements.
Support void reduction and de-airing evaluation.

Application Support

Evaluate component-to-heat-sink gap requirements.
Review compression, BLT, and thermal resistance targets.
Discuss dielectric, vibration, and thermal cycling reliability needs.

What’s Next

Soft Thermal Gels for High-Reliability Electronics

As electronics become more compact and thermally demanding, soft thermal gels offer a practical way to combine high thermal conductivity, electrical insulation, automated processing, and mechanical stress relief. DOWSIL™ TC-4060 supports this design direction with a 6 W/m·K silicone gel platform suitable for reliable component-to-heat-sink cooling.

Next Steps

Ready to Evaluate DOWSIL™ TC-4060?

Share your component type, heat sink design, target gap or bondline, compression level, cure preference, and dispensing process. We can help assess whether DOWSIL™ TC-4060 is suitable for your electronics thermal management application.

```

About Krayden

About Krayden

About Krayden

DOWSIL™ TC-4060 Thermal Gel

Main features

Product Description

DS-TC4060

Technical Specifications

Additional Information

DOWSIL™ TC-4060: 6 W/m·K Thermally Conductive Silicone Gel

6 W/m·K Thermal Conductivity • Room-Temperature Cure • Soft Gel Compliance • Stable up to 150 °C

Features & Benefits

Typical Applications

Thermal Challenges in PCB and Module Cooling

Engineering Data for DOWSIL™ TC-4060

Where DOWSIL™ TC-4060 Fits

Mixing, Dispensing & Cure

Mixing

Dispensing

Curing

How TC-4060 Supports Reliable Thermal Design

Tips & Troubleshooting

Technical Help for Thermal Gel Applications

Soft Thermal Gels for High-Reliability Electronics

Ready to Evaluate DOWSIL™ TC-4060?

Recently viewed products

Leading Brands Trust in Our Products and Services