LINQSOL EMC-9131 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Spiral flow
- Designed for SOT and Modules
- Low stress and Low Moisture Absorption
Product Description
LINQSOL EMC-9131 is a high-performance, eco-friendly epoxy molding compound engineered specifically for BGA and CSP encapsulation. Designed to minimize warpage, EMC-9131 features an ultra-low modulus and optimized linear shrinkage, ensuring reliable package integrity.
LINQSOL EMC-9131 its exceptional fluidity reduces wire sweep, even for fine-pitch packages and ultra-thin bonding wires. EMC-9131 also demonstrates outstanding adhesion to both PCB substrates and silicone chips, performing reliably in rigorous tests up to MSL2 @260°C. This versatile compound is compatible with a range of BGA, CSP, and QFN package types, including PBGA, LGA, FBGA, CABGA, CTBGA, FCBGA, FC-CSP, QFN, DFN, and more.
EMC-9131
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-9131
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
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