LOCTITE ECCOBOND FP4547
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Enhanced adhesion
- Rigid, low stress seal
- High purity
Product Description
LOCTITE ECCOBOND FP4547 liquid epoxy underfill is designed to provide enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90 to 120°C substrate temperature, with as little as a 2 to 3 mil gap.
When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. LOCTITE ECCOBOND FP4547 also exhibits low moisture absorption for improved JEDEC performance.
Recommended Cure Schedule
- 30 minutes @ 165°C
FP4547
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 50 days
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- ECCOBOND_FP4547_EN
- LOCTITE ECCOBOND FP4531 known as Hysol FP4531 5CC
- LOCTITE ECCOBOND FP4531 known as Hysol FP4531 5CC EN
Technical Specifications
Thermal Properties
Physical Properties
Recently viewed products
Hysol MG52F | Black Epoxy Mold Compound
- Designed for DL TSSOP packages
- Designed for copper (Cu) leadframes
- Excellent under biased humidity testing
LOCTITE ECCOBOND FP4450
- Fill Encapsulant
- High purity
- Good moisture resistance
MM211 | Maleimide adhesion promoter Additive
- Adhesion promoter
- Flexible aliphatic backbone
- Maleimide and carboxylic groups
LOCTITE ECCOBOND FP4470
- High purity
- Green product
- Handles solder reflow temperatures
HLP 2000 | Two part Thermal potting material
- Low Viscosity
- 2.0 Thermal Conductivity
- Room temperature cure
LOCTITE ECCOBOND FP4526
- Low viscosity
- Excellent wettability
- Hi-Pb and Pb-free applications
LOCTITE ECCOBOND FP4655
- Low stress
- Fine particle filler
- Combine with FP4451
Hysol GR2710 | Gold Epoxy Mold Compound
- For conductive polymer and AO capacitors
- Excellent thin wall crack resistance
- Fast cure for automold equipment
