Hysol GR640HV | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR640HV EMC for SOD devicesHysol GR640HV | Black Epoxy Mold CompoundGR640HV Black Epoxy Mold Compound PelletsGR640HV Black Epoxy Mold Compound

Main features

  • EMC for small outline packages including SOD, SOT and SMX
  • JEDEC 1 260°C capable product
  • Excellent electrical performance

Product Description

Hysol GR640HV is a black, transfer molded semiconductor epoxy molding compound. Once transfer molded and post-mold cured, it has excellent mechanical and electrical properties. It offers an excellent balance between outstanding performance, low stressm ease of use (which allows multiple shots between cleaning) and low cost of ownership.

Hysol GR640HV is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on small outline packages including SOT, SOD and SMX package types. Hysol GR640HV meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.

Hysol GR640HV is designed for the following semiconductor discrete packages:

  • Small outline transistor (SOT) packages
  • Small outline device (SOD) packages
  • SMA, SMB and other SMX packages
 
Product Family

GR640HV

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • GR640HV TDS 2017
    English (Technical Data Sheet (TDS))
  • SDS Hysol_GR 640 HV_EU_EN_2023
    English (Safety Data Sheet (SDS))
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
74 %
Specific Gravity Specific Gravity
1.83
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
160 °C
Thermal Conductivity Thermal Conductivity
0.85 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
6000000000000000 Ohms⋅cm
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.25 %
Chemical Properties
Moisture absorption Moisture absorption
0.52 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
75 cm
Curing Conditions
Transfer Pressure Transfer Pressure
40 - 100 kg/cm2
Transfer Time Transfer Time
10 - 15 s

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