Hysol GR640HV | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other




Main features
- EMC for small outline packages including SOD, SOT and SMX
- JEDEC 1 260°C capable product
- Excellent electrical performance
Product Description
Hysol GR640HV is a black, transfer molded semiconductor epoxy molding compound. Once transfer molded and post-mold cured, it has excellent mechanical and electrical properties. It offers an excellent balance between outstanding performance, low stressm ease of use (which allows multiple shots between cleaning) and low cost of ownership.
Hysol GR640HV is an environmentally "green" product, meaning that it doesn't contain any bromine, antimony or phosphorus flame retardants. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on small outline packages including SOT, SOD and SMX package types. Hysol GR640HV meets UL 94 V-0 Flammability at 1/8 inch (3.175mm) thickness.
Hysol GR640HV is designed for the following semiconductor discrete packages:
- Small outline transistor (SOT) packages
- Small outline device (SOD) packages
- SMA, SMB and other SMX packages
Packaging
TDS, SDS & Technical Documents
- GR640HV TDS 2017
- SDS Hysol_GR 640 HV_EU_EN_2023
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Curing Conditions
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