LOCTITE ECCOBOND UF 1173

Main features

One component
Low CTE
Automotive grade

Product Description

LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages for Automotive applications.

LOCTITE® ECCOBOND UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Importantly, the novel underfill exhibits high glass transition (Tg) temperature capability of 155°C and a low coefficient of thermal expansion (CTE) to ensure robust protection performance even under stressful conditions.

LOCTITE® ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified.

Cure Schedule

5 minutes @ 150°C

Packaging

Please select Package Type before adding your product to your cart.

TDS, SDS & Technical Documents

LOCTITE ECCOBOND UF 1173
English (Technical Data Sheet (TDS))
LOCTITE ECCOBOND UF 1173 Data Package 11-18
English (Technical documents)
CAPLINQ Underfill Material Handling Guide
English (Technical documents)
LOCTITE ECCOBOND UF 1173 NL-MSDS_UT_EN
English (Safety Data Sheet (SDS))
LOCTITE ECCOBOND UF 1173 NL-MSDS_UT_NL
Dutch (Safety Data Sheet (SDS))

Technical Specifications

General Properties

Pot Life

48 hours

Thermal Properties

Glass Transition Temperature (Tg)

160 °C

Thermal Conductivity

0.55 W/m.K

Physical Properties

Viscosity

7,5 mPa.s

Additional Information