LOCTITE ECCOBOND FP4451TD
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Encapsulant - DAM
- High purity
- Exceptional thermal stability
Product Description
LOCTITE® ECCOBOND FP4451TD damming material is designed as a flow control barrier around areas of bare chip encapsulation. It is designed for applications requiring a taller, narrow dam while also being ionically cleaner.
LOCTITE® ECCOBOND FP4451TD is the best DAM option available and it replaces the FP4451. "TD" stands for Tall Dam and implies that it has much better thixotropic properties. Due to the viscosity variation you can adjust the needle diameter in order to use the same DAM tool settings as with FP4451.
Recommended Cure Schedule
- 30 minutes @ 125°C plus
- 90 minutes @ 165°C
FP4451TD
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4451TD
- LOCTITE ECCOBOND FP4451TD known as HYSOL FP4451TD 30CC RDCD -40CD NL-MSDS_UT_NL (1)
- LOCTITE ECCOBOND FP4451TD known as HYSOL FP4451TD 30CC RDCD -40CD NL-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Other Properties
Physical Properties
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